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1

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

Nakamura, Yukio, Oohashi, Kenichi, Morita, Koji, Nomoto, Shuji, Suzuki, Takayuki, Takanezawa, Shin, Tsuchikawa, Shinji, Takekoshi, Masaaki

Year:

2015

Language:

english

File:

PDF, 2.51 MB

english, 2015

2

[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - New ultra low CTE material to reduce the warpage of thinner PKG

Kotake, Tomohiko, Murai, Hikari, Takanezawa, Shin, Miyatake, Masato, Takekoshi, Masaaki, Ose, Masahisa

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

3

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Ultra low CTE (1.8 ppm/°C) core material for next generation thin CSP

Kotake, Tomohiko, Murai, Hikari, Takanezawa, Shin, Miyatake, Masato, Takekoshi, Masaaki, Ose, Masahisa

Year:

2014

Language:

english

File:

PDF, 2.41 MB

english, 2014

4

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Newly developed ultra low CTE materials for thin core PKG

Miyatake, Masato, Murai, Hikari, Takanezawa, Shin, Tsuchikawa, Shinji, Takekoshi, Masaaki, Kotake, Tomohiko, Ose, Masahisa

Year:

2012

Language:

english

File:

PDF, 2.16 MB

english, 2012

5

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Challenge to zero CTE and small cure shrinkage organic substrate core material for thin CSP package

Sakamoto, Norihiko, Takanezawa, Shin, Tsuchikawa, Shinji, Takekoshi, Masaaki, Oohashi, Kenichi, Morita, Koji

Year:

2016

Language:

english

File:

PDF, 1.32 MB

english, 2016

6

Deformation Behavior of an Austempered Ductile Cast Iron Studied by Neutron Diffraction

OGAWA, Hitoshi, TOMOTA, Yo, KAMIYAMA, Takashi, SUZUKI, Hiroshi, TAKANEZAWA, Masaaki

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2008

File:

PDF, 1.22 MB

2008

7

A New Heat Resistant Cast Iron for Thin Wall Exhaust Manifold.

Takanezawa, Masaaki, Tomota, Yo, Kobayashi, Yoshinori

Journal:

ISIJ International

Year:

1998

Language:

english

File:

PDF, 696 KB

english, 1998

8

Development of Ultra Low CTE (Coefficient of Thermal Expansion) Substrate Materials for Semiconductor Package

Takanezawa, Shin, Murai, Hikari, Miyatake, Masato, Kotake, Tomohiko, Hashimoto, Shintaro, Abe, Shinichiro, Takekoshi, Masaaki, Ose, Masahisa, Morita, Koji, Iwasaki, Tomio

Year:

2016

File:

PDF, 2.32 MB

2016

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